How do SBCs Differ from Traditional Multi-Board Systems?

Form

SBCs are compact and self-contained, whereas traditional systems consist of multiple interconnected components spread across different boards.

Expandability

Traditional PCs allow users to upgrade components like CPUs, RAM, and storage. SBCs, on the other hand, are fixed configurations with limited paths for upgrades.

Power Consumption

SBCs are designed for low-power operation, making them ideal for battery-powered or embedded systems.

Performance

Ultimately, multi-board systems offer far more powerful performance. However, SBCs are still impressive for their size and are ideal for specialised and specific applications.

SBCs: Their Common Applications and Industries

As SBCs are especially suited for embedded applications, they are frequently deployed in environments where space and power efficiency are critical.

Why PCB Design is Critical in SBC Manufacturing

The success of any Single Board Computer hinges not only on the selection of components, but also on how effectively those components are incorporated into its printed circuit board (PCB) design.

This is crucial as the PCB is what makes the SBC function efficiently as a cohesive unit, serving as both its physical foundation and electrical anchor.

1. Component Placement and Layout Optimisation

Aneffective layout is essential to any PCB, but particularly so in the case of SCBs. Here, considerable computing power and specialised functions must be integrated into a small space.

The compact nature of SBCs demands highly strategic component placement. Designers must carefully position CPUs, memory modules, power circuitry, and connectors to maximise space utilisation without causing overcrowding or overheating.

For example, to avoid overheating on the PCB, heat-generating components should be placed further apart to prevent the formation of thermal hotspots. They should also be positioned in such a way that airflow through the circuit will help dissipate heat more effectively.

Additionally, traces, which are the electrical connections linking PCB components together, should be kept as short and direct as possible. This will minimise signal delay, avoid interruptions from crosstalk, and maintain strong overall signal integrity in the SCB.

2. Signal Integrity and High-Speed Design Considerations

Modern SBCs typically integrate high-speed interfaces, which can be sensitive to layout errors at the PCB level.

A key design practice to follow when designing the PCB for high-speed designs is incorporating controlled impedance routing. Without this, mismatches in impedance can occur and cause signal reflections, loss of signal fidelity, and timing errors.

To ensure matching impedance in the circuit, designers must carefully control the width and spacing of traces and optimise the layer stackup of the PCB.

Additionally, electromagnetic interference (EMI) is a major concern in dense SBC designs, where multiple high-frequency signals run close together. Proper EMI control will not only improve internal signal quality, but it is also essential for meeting regulatory compliance standards.

EMI can be mitigated by using solid ground planes beneath high-speed signal layers and applying shielding techniques such as guard traces or metal enclosures. In this way, electronics manufacturers can minimise noise in the PCB and provide clean return paths for signals.

These practices help ensure that SBCs operate reliably and stably under real-world conditions, particularly in complex applications like industrial automation and edge computing.

3. Power Management and Distribution

SBCs must power a variety of components, including CPUs, memory, wireless modules, and sensors, often within mobile or embedded environments. This makes clean, stable power delivery essential for high performance in SCBs.

Effective PCB design for power management includes the use of wide, low-resistance power traces or planes to properly handle the current capacity and avoid voltage drops. If traces on the PCB are too narrow, for instance, they will introduce resistance that causes drops in voltage, which may degrade the SCB’s performance or damage its components.

Another method is isolating power domains where required, especially on PCBs that mix digital and analogue signals. Separate power domains will prevent any digital circuit noise from spilling over into more sensitive analogue ones, ensuring that the SCB maintains precise and reliable performance.

4. Thermal Management in Compact Systems

Because SCBs are so compact and dense with high-performing components, thermal management measures are essential when designing the PCB.

Inadequate thermal design can lead to overheating, performance degradation, or even permanent hardware damage.

Some key heat management methods that EMS providers apply in PCB design for SCBs include:

• Thermal vias, which are plated holes that transfer heat from the surface-mounted components to lower or bottom copper layers of the PCB, allowing for efficient heat dissipation.
• Surface-mounted heat sinks or thermal interface materials, such as copper and aluminium, which are attached to heat-generating components or areas of the PCB to facilitate passive cooling.
• Strategically placing components on the PCB to avoid heat accumulation in any single area and promote even airflow across the board.

Effective heat management on the PCB level will help optimise the performance of the SCB and maximise the lifespan of its components.

5. Design for Manufacturability (DFM) and Design for Testability (DFT)

The process of designing an SBC goes beyond pure functionality. It must also be as simple and cost-effective as possible to manufacture, assemble, and test.

Consider an SCB that is highly functional but complex and difficult to manufacture. Such a design may face production bottlenecks, increased failure rates, or high rework costs, impacting time-to-market and efficiency.

By applying DFM and DFT principles, electronics manufacturers help reduce errors during PCBA manufacturing, ensuring that your product can be reliably mass-produced without introducing unnecessary delays, defects, or expenses.

Key practices in DFM include:

• Using proven, manufacturer-recommended materials to ensure component reliability and availability.
• Avoiding the inclusion of customised or rare components to reduce costs, shorten procurement time, and simplify sourcing from suppliers.
• Designing the PCB with automated assembly in mind. For example, the use of special grip-friendly features can facilitate gripping and handling of the PCB by automated machinery, making the assembly process smoother.

Key practices in DFT include:

• Incorporating access to test points in the PCB circuit so that voltage, signal integrity, and other metrics can be easily assessed during manufacturing.
• Ensuring the PCB is fitted with boundary scan or JTAG interfaces, which will allow the testing of solder joints and other components without the need for physical probing.
• Designing for in-circuit testing (ICT) by allowing space and access for probes to evaluate the performance of individual PCB components.

Incorporating DFM and DFT principles in the PCB design for your SBC will streamline production, reduce assembly errors, lower manufacturing costs, and help ensure the highest standards of quality in the finished product.

Common Challenges in SBC PCB Design

As SBCs continue to power devices and facilitate innovation across industries, several recurring challenges must be addressed in the PCB design process:

Balancing Performance with Physical Size and Cost Constraints

SBCs are expected to deliver strong computing capabilities in a compact, cost-effective package. This places significant pressure on PCB designers to fit high-performance components, such as processors and wireless modules, within restricted board dimensions.

Additionally, thermal and electrical integrity must also be preserved in this limited space to maintain peak SCB performance.

Managing Multi-Layer Complexity for High-Speed Designs

To support modern interfaces like PCIe and LPDDR memory, SBCs frequently require multi-layer PCBs. Complex designs may require up to 6 to 12 layers or more.

This presents challenges in planning optimal layer stack-ups, managing noise and interference in a highly dense environment, and maintaining signal integrity within the circuit.

Sourcing and Integrating Specialised Components

Depending on the intended application, SBCs often incorporate specialised components which can introduce challenges in sourcing and design integration.

Long lead times or shortages in customised or rare parts can delay projects, strain a company’s resources, and force costly late-stage redesigns.

Experienced EMS providers like PCI can help recognise such challenges early in the design process. We will apply sound engineering practices to design, test, and manufacture high-performance, reliable SBCs that meet cost, size, and functionality requirements across diverse applications.

Partner with PCI for Smarter SBC Design and Manufacturing

At PCI, we offer unmatched expertise and knowledge in single board computer technology, focusing on customised, industrial SBCs that address the inefficiencies of standard, off-the-shelf products.

• Our expertise in developing single board computer hardware, device drivers, and operating system (OS) customisation spans a diverse range of industries, including the commercial, transportation, and industrial sectors.
• We also provide long-term support for customisation needs, covering everything from OS upgrades to new device driver development.
• Our core strengths in PCB layout, rapid prototyping, PCBA manufacturing, assembly, and validation testing help clients bring complex designs to market, quickly and cost-effectively.

Collaborating with an experienced EMS provider like PCI ensures your Single Board Computer (SBC) projects will deliver high-performance, reliable solutions to your customers, all while meeting the highest standards of quality, efficiency, and scalability.

Contact our friendly team today to learn more about how we can support your next SCB project.