PCI Limited- Manufacturing Capabilites

Electronic and Electromechanical Manufacturing and Design Solutions

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Each PCI facility has RoHS compliant manufacturing lines. PCI has been manufacturing RoHS assemblies since early 2005

>>> Printed Circuit Board Assembly	>>> Optical Laser Alignment
>>> Chip on Board /Flex	>>> Sub-assembly and Complete Products
>>> Interconnects	>>> Test
>>> Conformal Coating and Epoxy Potting

•	Fully automated in-line SMT systems tailored for high volume or high mix production.
•	All PCI production facilities have identical Surface Mount manufacturing equipment and processes.
•	Speed capability up to 80,000 placements per hour per line.

•	Placement of 0201 components, BGA, Micro-BGA, and Chip Scale Packages on either Rigid or Flexible printed circuit boards.
•	No clean process
•	Hot Air reflow ovens (9 Zone) with N2 capability for Lead-Free production
•	Capable of double sided reflow
•	RoHS compliant Wave solder lines
•	Automatic insert for Axial Components, Radial Components and Jumpers.
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•	Chip on Board manufacturing since the late 1980s.
•	One of the largest Chip on Board operations in Asia
•	Experience and capability to assist in designing for COB assembly as well as converting existing designs to COB.
•	Screen print die encapsulation machines and encapsulation dispensing machines
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Hot-Bar Pulse Bonding, Tape Automated Bonding, and Heatseal machines

Interconnect types utilized:

•	Fine Pitch Anisotropic Conductive Film (ACF)
•	Anisotropic Conductive Adhesive/Ink (ACA/ACI)
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Semi-auto machines capable of achieving uniform thicknesses

Experience and precision Optical Laser Alignment systems for fiber optic communication equipment assembly

•	Additional product cost savings are an advantage to having PCI Limited provide much more value-added services beyond PCBA
•	Production lines, assembly processes, and all necessary jigs / fixtures are customized for every value-added sub-assembly and complete product
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PCI's testing services include system test program protocol development, integration for In Circuit Testing and full functional testing. The test group provides rapid development of test protocol and comprehensive development of jigs and fixtures for a wide range of applications.


•	Capability to convert test programs from other major ICT tester platforms
•	Capabilities to design and fabricate specific software and hardware functional test systems for product testing.
•	In-line tuning and functional testing with shielded cages or shielded box solutions.

Wide range of test equipment and systems:
•	In Circuit Testers: Teradyne machines, HP, Genrad, and Okano
•	Communications test sets: HP, Marconi, Rohde and Schwarz.
•	HP Spectrum analyzers.
•	Audio generators, analyzers, telephone test sets, and RF signal generators.
•	Programmable power supplies, voltmeters, and oscilloscopes.
•	Comprehensive jigs, fixture design and commissioning capability.
•	X-ray Inspection testing.

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